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UL flame retardant potting glue

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Product Abstract:

Used for solar energy, HID, LED electronic screen, circuit boards, electronic components, potting, then, coating.


Product Description

A, use the flame retardant potting glue

 

Used for solar energy, HID, LED electronic screen, circuit boards, electronic components, potting, then, coating.

 

Second, the flame retardant potting glue features

 

1, rubber blend under the conditions of the storage time is longer, but under the condition of heating fast curing, especially for the use of automatic production line.

 

2, temperature resistance, good resistance to high temperature aging. After curing in the wide temperature range (60 ~ 250 ℃) to keep the rubber elasticity, excellent insulation performance. 3 no shrinkage, curing process, has better waterproof and anti-aging performance.

 

4, low viscosity, good fluidity, the bubble is good, can be cast to the subtleties, can be convenient to make potting complex electronic components.

 

After 5, detachable resistance, sealing components remoable for repair and replacement, and then use the pouring sealant for repair can be a trace.

 

Three, flame retardant potting glue technical indicators

 

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

 

Four, flame retardant potting glue usage

 

Will A, B two groups from A weight than said above, mix and stir to mix well, after vacuum deaeration or stand for the electronic components, and about 1.5 hours after filling and sealing surface curing.

 

Five, the flame retardant potting glue matters needing attention

 

1, this product curing speed has close relationship with temperature, the higher the temperature, the faster the curing; Users can according to the high or low temperature, proper adjustment of the amount of curing agent, can achieve the ideal curing speed.

 

2, add molding products with tin, phosphate, ammonium, water, chlorine, carboxylic acid, mercaptan, bad later silicone poisoning the chemical reaction, so should be to avoid these reactions.

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