A, high/low temperature resistance electronic potting glue application

Used for solar energy, LED, back light, HID, LCD, electronic display screen, circuit boards, electronic potting, then, coating, can also be used for electronic circuit potting circuit, the voltage control. Apply to electronic accessories insulation, waterproof and fixed. Full compliance with the eu ROHS directive requirements.

Second, the high/low temperature resistance of electronic potting glue features

Chromate-free organic silicon, silicon gel is made from organic silicon synthesis of a new type of insulating material, curing with no heat, no corrosion, low shrinkage rate, etc, used for various electronic components, pouring, sealing form insulation system. Room temperature curing, easy to use; In a wide temperature range of elasticity, insulation performance; Dust waterproof mouldproof, the fixed components, chemical medium, yellowing resistance, resistance to weathering.

Three, high/low temperature resistance electronic potting glue technology parameters

Before solidification product model 3304, 3311, 3301, 3300

A: B 10:1 now now now

Color black white grey transparent appearance

Viscosity (Mpa) s) A 6000-8000, 6000-8000, 6000-6000 3000-500

B 0.1 0.1 0.05 0.1

Density (g/cm3) A 1.35 + / - 0.5 1.35 + / - 0.5 0.5 0.98 0.2 mm

B 0.9 0.9 0.86 0.9

Operating time (min) and 40 + 5 to 40 + 5 + 5 30 to 50 + 10

Curing time (h) 5 to 6 + 1 + 1 + 1 to 7 + 1

After curing Shore hardness A 30 + / - 5 to 30 + 5 to 30 + 18 + 2

Waterproofing of IPX6 - IPX8

Tear strength (1.8 KN/m)

Tensile strength (Mpa) 1 + / - 0.2

The elongation at break (%) 150 + 30

The electrical characteristics of the flame retardant grade UL94 - V1 UL94 - where V0 UL94 - V1 UL94 - VH

Thermal conductivity (W/(m K) 0.6 0.8 0.6 0.8 0.6 0.8 0.3 or higher

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

Four, high/low temperature resistance of electronic potting glue steps

1, will be potting surface derusting, decontamination and clean.

2, A and B component proportion fully to make.

3, put the glue on the surface of liquid to be potting and let stand for 2-4 hours.

Five, the high/low temperature resistance of electronic potting glue considerations

1, this product curing speed has close relationship with temperature, the higher the temperature, the faster the curing; Users can according to the high or low temperature, proper adjustment of the amount of curing agent, can achieve the ideal curing speed.

2, this series product is a non-dangerous goods; But in use process, such as curing agent contact with skin, wash with detergent and water. Such as curing agent for the eyes, immediately wash with clean water for at least 15 minutes, and consult a doctor