A, use the power pouring sealant

Power pouring sealant was silicone and forming a kind of potting glue, AB glue to 1:1 mixed after curing of switch power supply, LED driver power supply, car HID lamp modules such as power supply, ignition system module power supply have the effect of waterproof sealing protection. Completely satisfy all kinds of heat loss, heat resistance, insulation requirements. Don't shrink in the process of curing, has the good waterproof and anti-aging performance.

Second, the electric flow pouring sealant properties

(1) excellent adhesion, copper, aluminum, stainless steel, iron, tin, PCB, ABS, PVC, PET, PBT, PC, such as Epoxy has good adhesion.

(2) performance is excellent, can withstand 100 ℃, 150 ℃ and electric properties under high temperature and high humidity environment test.

(3) excellent flame retardant properties of flame retardant level of UL 94 v - 0.

(4) excellent thermal conductivity, thermal conductivity is 0.8 W/m.K.

(5) the best system viscosity, 2000 mpa. S the viscosity of the filling and sealing operation easily.

6 curing process without shrinkage, after curing to form elastic protection.

All landowners, operation time can be adjusted according to made process and curing time.

3, power supply pouring sealant technology parameters

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Four, power potting glue method of use

: before 1, mix part A and part B separately by manual or mechanical stirring fully, avoid as filler sedimentation and lead to change in performance.

2, mixed: according to the ratio of 1:1 weighing two components in a clean container and error must not exceed 3%, otherwise it will affect performance after curing.

3, deaeration: can the natural deaeration and vacuum deaeration, natural deaeration: will mix glue let stand 20-30 minutes, vacuum deaeration, vacuum degree is 0.08-0.1 MPa, vacuum 5-10 minutes.

4, perfusion: should be in the operating time will finished rubber perfusion, otherwise affect flow flat. Keep clean and dry before potting substrate surface. Will mix good rubber filling for filling and sealing device, generally don't vacuum deaeration, if need to get the high thermal conductivity, suggested that vacuum deaeration after reperfusion. (vacuum degree of vacuum deaeration: 0.08 to 0.08 MPa, vacuum 5-10 minutes)

5, cure: room temperature or heat curing. Adhesive curing temperature and curing speed has a lot to do, in the winter need a long time to cure, recommended heating mode curing, curing 15 to 30 minutes under 80 ℃, usually takes about six to eight hours under room temperature curing.

Five, the power pouring sealant used matters needing attention

1, a two-component power pouring sealant is sensitive to the environment temperature, storage should be paid attention to when dry and sealed.

2, add power potting silicone molding contact containing N, P, S organic compounds, Sn, Pb, Hg, As and other elements of ionic compounds, including alkynes and much of vinyl compounds can't cure or cure incomplete phenomenon known As "poisoning". Solder point on the circuit board and residues of rosin contain the compounds, is the circuit board when using, should try to wash the residue of rosin on circuit board, using low lead solder as far as possible, and adopt the way of heating curing curing. Common materials and objects: easy cause poisoning leaded solder and flux, hot melt adhesive, condensation silicone (including single and type of two-component condensed silica gel), rubber, etc.