A, use the thermal conductivity silica gel

Thermal conductive silicone is widely used in various electronic products, electrical equipment of the heating element (power tube, silicon controlled rectifier, electric shocks, etc.) and the cooling facilities (radiator, radiator, shell, etc.) between the contact surface, the heat transfer medium and moistureproof, dustproof, corrosion and shock, etc. Is suitable for the microwave communications, microwave transmission equipment, power supply, regulated power supply and other microwave devices dedicated microwave potting, the surface coating or the whole of this kind of silicone material to produce hot electronic components, provides the excellent effect of thermal conductivity. Such as transistors, CPU, assembling, thermistors, temperature sensors, automotive electronic components, car refrigerator, power supply module, printer, the first class.

Second, the thermal characteristics of silica gel

1, the range of coefficient of thermal conductivity and stability;

2, process of poor workers in bridge structure, reduce the radiator and poor heat dissipation structure craft work requirements;

3, EMC, good insulation performance;

4, thermal conductive silicone with high thermal conductivity, good thermal conductivity, good insulation resistance, the use of wide temperature, good use of stability, low consistency and good construction performance.

Three, thermal conductivity silicone technology parameters

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

Fourth, thermal conductivity silicone instructions

Thermal conductive silicone can good filling contact clearance, will squeeze the contact surface, air is a poor conductor of heat, will be a serious impediment to heat transfer between the contact surface; With the supplement of the thermal conductive silicone piece can make contact better full contact, truly the face-to-face contact. The temperature on the reaction can reach as far as possible small temperature difference.

The effect of thermal conductivity of thermal conductive silicone is relative, though it has good performance of thermal conductivity in the flexible material, generally in 0.6 1.5 W/(m K) within the scope of the minority performance could be higher, but no more than 2 W/(m K). Compared to water, vulcanized rubber, vaseline, 0.22 0.5 0.184 [1], and so on. But and cement 1.5 W/(m K), there is no advantage. And the coefficient of thermal conductivity of almost all metals, are much higher than thermal conductivity silica gel. The coefficient of thermal conductivity of metal cicc, silver, copper between 330 ~ 360, the coefficient of thermal conductivity of aluminum is about 200. Thermal conductive silicone itself is not a good conductor of heat, the effect of thermal conductive silicone is to fill the space between the heat source and heat sink. So the use of thermal conductive silicone is the thinner the better, can apply 0.1 0.5 mm thick thermal conductivity silica gel to fill the gap, the effect is better than 1 mm thick silicon sheet.

Five, the thermal conductivity silica gel

1, this product curing speed has close relationship with temperature, the higher the temperature, the faster the curing; Users can according to the high or low temperature, proper adjustment of the amount of curing agent, can achieve the ideal curing speed.

2, add molding products with tin, phosphate, ammonium, water, chlorine, carboxylic acid, mercaptan, bad later silicone poisoning the chemical reaction, so should be to avoid these reactions.