A, thermal silica is introduced

Heat dissipation silica gel is a low thermal resistance and high thermal conductivity, high flexible thermal conductive materials. The material has high softness can reduce the required pressure between components, at the same time covering the micro uneven surface to make good contact with components and improve the efficiency of heat conduction, especially suitable for limited space of heat transfer requirements. Good thermal conductivity.

Second, the heat dissipation silica gel purposes

Widely used in the military-industrial complex, computers, communications equipment, consumer electronics, power supply, automotive electronics, industrial electronics and other fields, in order to improve the reliability of electronic components, and increase its service life. We can provide you with different thickness from 0.5 mm to 8.0 mm of ultra soft high heat conductivity filler material.

Three, thermal silica gel using matters needing attention

(1) to ensure that the CPU surface clean.

The area of contact (2) determine the heat sink to the CPU extrusion cooling paste, dosage range of about 0.2 mm to 0.5 mm.

(3) with blade to stir up a small piece of thermal oil is transferred to the corner of a CPU core.

(4) to finger into plastic belt, radiator cooling at the bottom of the cream over the entire CPU part.

5. Wipe the thermal paste, in different colors.

Those from the corner of the CPU core to continue to heat paste evenly over the entire core, whether the cooling paste is thin to transparent.

All landowners to confirm if there is a foreign body surface, CPU to finish.

Please contact us allocate thermal silicone technology parameters