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Transformer pouring sealant

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Product Abstract:

The electronic components used to work under high temperature condition of bonding, sealing, potting and coating, can rise to moistureproof, dustproof, insulation, heat insulation, confidentiality, corrosion resistance, high temperature resistance, shock, and improve the performance and stability parameters.


Product Description

A, use the electronic potting glue

 

The electronic components used to work under high temperature condition of bonding, sealing, potting and coating, can rise to moistureproof, dustproof, insulation, heat insulation, confidentiality, corrosion resistance, high temperature resistance, shock, and improve the performance and stability parameters.

 

Second, electronic potting glue

 

High temperature resistant rubber modified epoxy resin with excellent oil resistance, water resistance, acid resistance, alkali, organic solvent and high temperature resistance, and excellent dielectric properties, are widely used in high temperature sensors, electronic components, transformers, rectifiers, AC capacitor, ignition coil, the electronic module, ignition coil, atomizer and other products.

 

Three, electronic potting glue technology parameters

 

Before solidification product model 3304, 3311, 3301, 3300

A: B 10:1 now now now

Color black white grey transparent appearance

Viscosity (Mpa) s) A 6000-8000, 6000-8000, 6000-6000 3000-500

B 0.1 0.1 0.05 0.1

Density (g/cm3) A 1.35 + / - 0.5 1.35 + / - 0.5 0.5 0.98 0.2 mm

B 0.9 0.9 0.86 0.9

Operating time (min) and 40 + 5 to 40 + 5 + 5 30 to 50 + 10

Curing time (h) 5 to 6 + 1 + 1 + 1 to 7 + 1

After curing Shore hardness A 30 + / - 5 to 30 + 5 to 30 + 18 + 2

Waterproofing of IPX6 - IPX8

Tear strength (1.8 KN/m)

Tensile strength (Mpa) 1 + / - 0.2

The elongation at break (%) 150 + 30

The electrical characteristics of the flame retardant grade UL94 - V1 UL94 - where V0 UL94 - V1 UL94 - VH

Thermal conductivity (W/(m K) 0.6 0.8 0.6 0.8 0.6 0.8 0.3 or higher

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

 

Fourth, electronic potting glue operation method

 

1. Mix before, first put A components mix adequately, the settlement black paint fully mixing, B component fully shake.

 

2. Mixed, shall comply with the components: A team B = weight ratio of 10:1.

 

3. When used according to the need for deaeration. Can mix A and B, the mixture evenly into the vacuum container, after the deaeration 3 minutes at 0.08 MPa, perfusion can be used.

 

4. Perfusion and placed in a room temperature curing, into the next procedure, basic after curing, completely curing need to 24 hours. Environment has a great influence on temperature and humidity on the curing.

 

Use five, electronic potting glue the note

 

1, the rubber should be sealed storage. Mix good rubber should be finished at a time, avoid to cause waste.

 

2, this product is a non-dangerous goods, but not entrance and eye. If gets into the mouth, eyes, wash immediately with water or to the hospital.

 

3 deposit, after a period of time, colloid is likely to stratification. Please mix after use, do not affect performance.

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