A lot of, electronic potting glue purposes

Used for solar energy, HID, LED electronic screen, circuit boards, electronic components, potting, then, coating.

Second, add molding electronic potting glue features

This product is A two-component RTV electronic potting glue, consists of two components, A, B, and the low viscosity, easy, easy to mix perfusion, the product after curing shrinkage rate is small, has excellent high and low temperature resistance, corrosion resistance, radiation resistance, insulation, waterproof, moisture, shock, thermal conductivity, flame retardant, corrosion resistance and excellent electric properties, can be in - 50-200 ℃ within the scope of use for A long time.

Three, and molding technology of electronic potting glue index

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

Four, plus molding electronic potting glue used method

Will A, B two groups from A weight than said above, mix and stir to mix well, after vacuum deaeration or stand for the electronic components, and about 1.5 hours after filling and sealing surface curing.

Five, plus molding electronic potting glue matters needing attention

1, this product curing speed has close relationship with temperature, the higher the temperature, the faster the curing; Users can according to the high or low temperature, proper adjustment of the amount of curing agent, can achieve the ideal curing speed.

2, add molding products with tin, phosphate, ammonium, water, chlorine, carboxylic acid, mercaptan, bad later silicone poisoning the chemical reaction, so should be to avoid these reactions.