A, use the pouring sealant of thermal conductivity

Pouring sealant is a low viscosity of thermal conductivity of two-component silicone potting glue of thermal conductivity, good heat dissipation effect, room temperature curing, also can heat curing, has the characteristics of the faster the higher curing temperature. Don't produce any by-products in the curing reaction, small shrinkage rate, can be applied to the PC (Poly real - carbonate), PP, ABS, PVC and other material and the surface of the metals. Applicable to electronic accessories of thermal conductivity, insulation, waterproof and flame retardant, the flame retardant can reach UL 94 v - level 0, in full compliance with the eu ROHS directive requirements.

Second, the pouring sealant properties of thermal conductivity

(1) high and low temperature resistance, water resistance, weathering resistance.

(2) with high thermal conductivity, good thermal conductivity, good insulation.

(3) low viscosity, good construction performance.

(4) has excellent thermal conductivity (heat dissipation performance), the coefficient of thermal conductivity can be more than 1.0 after curing.

Three, thermal conductivity tong-ma epoxy pouring sealant technology parameters

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Fourth, thermal pouring sealant using method

According to weight ratio, with A: B = 1:1 ratio of mixed sizing after mixing evenly, pay attention to in order to guarantee the good performance of products, part A and B in 1:1 mix before, after their respective need to fully mix, weighing sampling matching again, and then mix with good rubber uniform glue potting.

Five, the thermal pouring sealant used points for attention

1 affected by temperature, curing speed, high temperature curing rate will accelerate, operation time is reduced, low temperature curing speed will slow, operation time will be extended accordingly.

2, if on a particular object or material will cause hinder curing in doubt, suggest a small test to determine the applicability of this application. If the experiment phenomenon curing or local not curing does not appear, you can rest assured use.

3, if potting thicker and good to potting curing the product appearance after the demand is higher, can according to the conditions on the vacuum processing the air bubbles out again after potting.