A, plus molding adhesive electronic potting glue features and USES

Add molding 10:1 adhesive electronic potting glue for A two-component curing electronic potting glue, consists of two components, A and B; After curing rubber, rubber and circuit board, circuit, electronic components and the shell has a very strong seamless bonding, so as to form a whole.

This product in curing does not release, don't produce any by-products, so almost no contraction after curing; Due to the product itself has high and low temperature resistance, corrosion resistance, radiation resistance, ageing resistance, insulation, waterproof, moisture, shock, heat conductivity, flame retardant, corrosion resistance, such as performance, coupled with excellent stick relay, so the product is used for solar energy, HID, LED electronic screen, circuit boards, outdoor electrical appliances, electrical appliances, electrical appliances and other electronic components damp underwater sealing and bonding of the best materials.

This product can in - 50 ℃, 250 ℃ within the scope of use for a long time; Is completely in line with the eu ROHS directive requirements.

Second, add molding adhesive electronic potting glue technical indicators

Before solidification product model 3304, 3311, 3301, 3300

A: B 10:1 now now now

Color black white grey transparent appearance

Viscosity (Mpa) s) A 6000-8000, 6000-8000, 6000-6000 3000-500

B 0.1 0.1 0.05 0.1

Density (g/cm3) A 1.35 + / - 0.5 1.35 + / - 0.5 0.5 0.98 0.2 mm

B 0.9 0.9 0.86 0.9

Operating time (min) and 40 + 5 to 40 + 5 + 5 30 to 50 + 10

Curing time (h) 5 to 6 + 1 + 1 + 1 to 7 + 1

After curing Shore hardness A 30 + / - 5 to 30 + 5 to 30 + 18 + 2

Waterproofing of IPX6 - IPX8

Tear strength (1.8 KN/m)

Tensile strength (Mpa) 1 + / - 0.2

The elongation at break (%) 150 + 30

The electrical characteristics of the flame retardant grade UL94 - V1 UL94 - where V0 UL94 - V1 UL94 - VH

Coefficient of thermal conductivity (W/(m K) 0.6 0.8 0.6 0.8 0.6 0.8 0.3 or higher

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Note: the parameters in the table colloid viscosity, color, transparency, hardness, etc according to the customer's demand.

Three, plus molding adhesive electronic potting glue method of use

Will A, B two groups from A weight than said above, mix and stir to mix well, after vacuum deaeration or stand for the electronic components, and about 1.5 hours after filling and sealing surface curing.

Four, plus molding adhesive electronic potting glue matters needing attention

1, this product curing speed has close relationship with temperature, the higher the temperature, the faster the curing; Users can according to the high or low temperature, proper adjustment of the amount of curing agent, can achieve the ideal curing speed.

2, because this product and turpentine, solder, phosphate, ammonium, water, chlorine, chemical compounds such as carboxylic acid, mercaptan, bad will happen toxic reaction; It is recommended to use before application of anti-corrosion paint after soaking with the goods, to avoid not curing phenomenon.

3 B component, has not used up, should be sealed storage.

4, this product is recommended temperature curing, the temperature above 60 ℃.

Five, plus molding adhesive electronic potting glue packaging, storage and matters needing attention

1, this product USES 5 kg, 20 kg, 25 kg, 200 kg plastic drum.

2, the product of thermal conductivity and flame retardant material, use of such as precipitation, stir well can continue to use, after the performance unchanged.

3, this product should be sealed storage in shady and cool place, prevent and, according to the transport of dangerous goods;

4, this product is valid for a year.