A, flame retardant heat conduction electronic potting glue is introduced

This product is a low viscosity of two-component molding flame retardant potting glue of thermal conductivity, room temperature curing, also can heat curing, the faster the higher curing temperature. Don't produce any by-products in the curing reaction, can be used for PC, ABS, PVC and other materials and metals potting, can achieve UL94 level where V0 flame retardancy, completely in line with the eu ROHS directive requirements.

Second, flame retardant thermal electronic potting glue purposes

Widely used in high power electronic components, for cooling and heat resistance to demand higher module power supply and potting protection of circuit board. Such as AC/DC power supply module, control module, car HID ballast potting, automotive sensors, LED lamps and lanterns, driving power, USP power, semiconductor rectifier module encapsulation, and so on.

Four, flame retardant electronic potting glue technology parameters of thermal conductivity

Before solidification product model 1301, 1302, 1303, 1300

A: B 1:1 1:1 1:1 1:1

Color white black gray transparent appearance

Viscosity (Mpa) s) A 3000 + 500 + 500 3000 3000 + 500 2000-500

B 3000 + 500 + 500 3000 3000 + 500 2000-500

Density (g/cm3) A 1.48 + / - 0.2 1.48 + / - 0.2 0.2 0.98 0.2 mm

B 1.48 + / - 0.2 0.2 + / - 0.2 1.48 0.98 0.2 mm

Operating time (min) 50 plus or minus 10 to 50 + 10 to 50 + 10 to 50 + 10

Curing time (h) to 8 + 8 + 8 + 1 + 1

After curing Shore hardness A 30 + 2 to 30 + 2 to 30 + 2 to 30 + 2

Waterproofing of IPX5

Tear strength (1.0 KN/m)

Tensile strength (Mpa) 1.2

Elongation at break (%) 110

The electrical characteristics of the flame retardant grade UL94 - where V0 UL94 - where V0 UL94 - where V0 UL94 - VH

Coefficient of thermal conductivity (W/(m K) or greater acuity 0.6 0.6 or 0.3 or 0.6

Heat resistance (℃) - 50-250

Volume resistivity (Ω. Cm) 1014 or more

The breakdown voltage (kv/mm) 20 or more

Dielectric voltage (50 hz), 2.7 to 3.3

Dielectric loss (50 hz) of 0.02 or less

Four, flame retardant electronic potting glue using method of thermal conductivity

Before 1, mixing, first of all, the part A and part B in the respective container fully stir well.

2, mixing, shall abide by the part A: B = 1:1 weight ratio.

3, in general, 20 mm below the mold can be moulded with the deaeration, because of the high temperature curing speed or moulded depth is deeper, so according to the need for deaeration. At this time in order to remove the moulding surface and the inside bubble, after should put the mixture into the vacuum container, under 0.08 MPa deaeration at least 5 minutes.

4, should be in the above technical parameters given in the table of before and after the curing temperature, keep the corresponding curing time, if the thickness is thicker, curing time may be over. At room temperature or heat curing. Rubber because of the influence of curing temperature, curing speed of the winter should be a long time to cure, recommended heating mode curing, curing under 80 ~ 100 ℃ for 15 minutes, usually takes 8 hours under room temperature curing.

Note: the following material may hinder the curing of the product, or not curing occur, so the best application after the validation check is easy, when necessary, the need to wash application area.

Five, the flame retardant thermal electronic potting glue matters needing attention

1, the rubber should be sealed storage. Mix good rubber should be finished at a time, avoid to cause waste.

2, this product is a non-dangerous goods, but not entrance and eye.

3 deposit, after a period of time, gum is likely to stratification. Please mix after use, do not affect performance.

4, in use process, avoid contact with the following material: a, organic tin compounds and organotin silicone rubber; B, sulfur and sulfide and sulfur rubber materials; C, amine compounds, and material containing amine.