Pouring sealant of thermal conductivity

Type: type thermal insulation

Origin: shenzhen,

Material: silica gel

Color: white, translucent

Product description: molding pouring sealant of thermal conductivity (HCY) is a kind of low viscosity flame retardant bi-component molding silicone potting glue of thermal conductivity, can be solidified at room temperature, can also heat curing, has the characteristics of the faster the higher curing temperature, is one of the most common organic silicone and epoxy system...

Pouring sealant of thermal conductivity

Add molding pouring sealant of thermal conductivity (HCY) is a kind of low viscosity fire retardant bi-component molding silicone potting glue of thermal conductivity, can be solidified at room temperature, can also heat curing, the higher the temperature the faster the curing characteristics of the most common is the organic silicone rubber system and the two kinds of epoxy system.

Pouring sealant of thermal conductivity is a two-component silicone potting glue, of thermal conductivity in a wide range of temperature and humidity, can be long-term reliable protection of sensitive circuits and components, with excellent electrical insulation properties, can reduce the pollution of the environment, avoid due to environmental factors such as stress and vibration and damp to the product damage, especially suitable for filling and sealing material with good sex of cooling products.

The product has excellent resistance to chemical and physical properties. With 1:1 blend to room temperature curing or heating fast curing, small shrinkage, in the process of curing exothermic not solvents or curing by-products, is repairable, can be solidified into a deep elastomer. Currently on the market do better thermal pouring sealant manufacturer - this system industry.

Thermal conductivity potting glue application

Main application field is electronics, power supply module, high-frequency transformers, connectors, electrical components and electrical component potting, have used similar temperature sensor potting, electric components and circuit boards and other products of insulating thermal conductive potting.

The use of the thermal conductivity potting glue process

1, according to the weight ratio of the two components in the mixing tank and stir evenly.

2, good to mix rubber filling for filling and sealing device, generally don't vacuum deaeration, if need to get the high thermal conductivity, suggested that vacuum deaeration after reperfusion. At room temperature or heat curing. Adhesive curing temperature and curing speed has a lot to do, in the winter need a long time to cure, recommended heating mode curing, curing under 80 ℃ for 5-10 minutes, room temperature curing in about 6 hours.