Breast prosthesis using silica gel:

The basic model for SG1008/09

Product description: gel is made up of liquid and solid is called a "coexistence of solid and liquid materials" type material of this kind of material with high molecular compound constitute mesh structure, with the solid filler island structure. Because of their interaction and shows its unique properties. Add SG1008AB/SG1009AB molding silicon gel is a kind of not add or containing a small amount of filler (SiO2, MQ resin) low crosslinking density of the liquid silicone rubber. Look like jelly, so also known as the jelly glue.

2. Product features:

The physical properties of the silicone gel has very little to do with temperature, can be in relatively wide temperature range (- 50 ℃ ~ 200 ℃) in use;

Colorless transparent;

Use of platinum complex catalyst, non-toxic, no smell

Superior electric properties and weather resistance;

Liquidity is good, can be injected subtleties (micro components can be used for integrated circuit);

Damping properties can be adjusted, the other from rubber hardness are also free to change to liquid;

The molding;

Can add packing in electrical conductivity.

3. Application: breast prosthesis

4. The method of use: will A, B in proportion to mix evenly, vacuum deaeration, then can use the note or injection molding. Mold temperature 80-150 ℃, the time between 8 to 60 minutes.

5. Packing: 20 kg/barrel or 200 kg/barrel.

6. Storage: sealed, cold dark environment preservation.

7. Typical physical properties:

Physical properties

SG1008

SG1009

appearance

A colorless transparent liquid,

B for red meat or transparent liquid

A colorless transparent liquid, B is light blue or transparent liquid

viscosity

800-1200 mpa. S

1000-1200 mpa. S

Using the proportion

A: B = 1:1

A: B = 1:1

Applicable period

8 hours at room temperature

8 hours at room temperature

Cone into the degree of

65

70

Volume expansion coefficient

0.096

0.096

Volume resistivity (Ω CM)

2 x 1015

2 x 1015

Dielectric constant (50 hz)

2.7

2.7

Dielectric loss tangent

(50 hz) : 0.002

(50 hz) : 0.002

8. Note: : avoid contact with nitrogen, phosphorus and organic compounds of sulfur and arsenic, tin, lead compounds.